Qualcomm announces the Snapdragon 865 and Snapdragon 765

A larger 3D Sonic Max fingerprint sensor was also teased.

Chipmaker Qualcomm took to stage at its annual Snapdragon Tech Summit to unveil the next-generation of mobile chips. These include the flagship 865-5G, and the midrange 765 and 765G. Moreover, the firm also teased the successor of the 3D Sonic Sensor – the 3D Sonic Max.

Qualcomm announces the Snapdragon 865 and Snapdragon 765
Image Source: NDTV Gadgets

Snapdragon 865-5G

The 865-5G chipset takes leaps in terms of features to be supported. This list includes 8K 30 FPS video recording, 64MP still frames for 4K video, fast slo-mo modes, and the capability to shoot 200 MP images. Yes, that’s right there the futuristic specifications. Heck, most of the modern devices don’t even have a 4K display. The chipset also gets a 2x increase in performance as compared to 855, and a 3x improvement over that of competitors.

Snapdragon 765, 765-5G

Talking about the 765 and 765G chipsets, they will feature an integrated 5G modem. This means that users will be able to buy 5G phones that won’t cost $1,000 or ₹71,740. SVP and GM of mobile at Qualcomm, Alex Katouzian mentioned at the Tech Summit that the Snapdragon 865 can be paired with Qualcomm’s Snapdragon X55 modem for 4G and 5G connectivity. The advantages include being a more power-efficient process, higher theoretical download and upload speeds, support for standalone (SA) networks in addition to non-standalone (NSA), support for mmWave and sub-6GHz in FDD frequencies, and more bandwidth at sub-6 GHz frequencies.

2020 Android flagship smartphones could equip the Snapdragon X55 multi-mode modem along with the new Snapdragon 865. Chinese manufacturer Xiaomi had confirmed that the forthcoming Mi 10 will in fact employ the Snapdragon 865. Opp, too, confirmed that the smartphones launched by them in Q1 2020 will come with the newly launched chipset. Rumors are rife that Motorola could take a shot in the flagship segment with the help of this chipset.

3D Sonic Max

Qualcomm announces the Snapdragon 865 and Snapdragon 765

Apart from the chipsets, Qualcomm also announced the 3D Sonic Max, a sequel to the slow 3D Sonic Sensor. Right now, it’s been utilized in the Galaxy S10, S10 Plus, Note 10, Note 10 Plus, and the 5G Galaxy phones.

Upgrades include – a recognition area that is 17x larger than previous ones. So the new sensor is 30mm by 20mm in size, which will allow for 1::1,000,000 versus previously 1::50,000 accuracies. This lets users use two fingers at once, which makes way more room for better security. Moreover, users can find the exact position of the sensor that will improve unlocking speed, thanks to the larger space on the screen

This development is interesting as Qualcomm’s 3D Sonic Sensor caused security problems with the S10 & the S10 Plus so rumors are rife that Samsung might abandon the sensor. If the 3D Sonic Max is really an improved upgrade, many more devices with OLED screens could use it. Only February 2020 could determine whether or not Samsung will use the 3D Sonic Max in its S11 series.

RECENT NEWS

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.